4900P SAC305, Lead Free Solder Paste, No Clean, 25 G (0.9 Oz)

Description: 3% Silver (SAC305) formulaNo Clean Flux (Residues are Non-corrosive, Non-conductive)Easily DispensedExcellent WettabilityIdeal for surface mount applications MG Chemicals has developed a unique flux system designed specifically for high temperature Unleaded alloys. It provides the fluxing activity levels that promote thermal stability and prevents thermal degradation when reflowing under air atmosphere (normal). Since use of nitrogen is not required, MG 4900P Unleaded Solder paste will provide excellent cost savings. In addition, MG 4900P Unleaded solder paste exhibits superior joint strength, excellent wettability, and extraordinary print definition and tack life. The post soldering residues of MG 4900P are non-conductive, non-corrosive and highly insulated.

Price: 46.05 USD

Location: Clarksville, Tennessee

End Time: 2024-08-30T14:10:43.000Z

Shipping Cost: 0 USD

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Item Specifics

Restocking Fee: No

Return shipping will be paid by: Seller

All returns accepted: Returns Accepted

Item must be returned within: 30 Days

Refund will be given as: Money Back

Brand: Does not apply

MPN: Does not apply

Item model number: 4900P-25G

Unit Count: 1 Each

Item Volume: 25 Milliliters

Product Dimensions: 1.97 x 0.79 x 7.87 inches; 0.88 ounces

Country of Origin: USA

Sterility Rating: SAC305

Size: 0.9 oz

Type: Does not apply