Description: SOM SPECIFICATIONS Dimensions (with heat spreader) 77 mm x 60 mm x 11 mm Application Processor Quad-core Arm® Cortex®-A53 MPCore™ up to 1.5 GHz Real-Time Processor Dual-core Arm Cortex-R5F MPCore up to 600 MHz Graphics Processing Unit Mali™-400 MP2 up to 667 MHz Video Codec Unit (VCU) 1 - up to 32 streams (total resolution ≤ 4Kp60) Trusted Platform Module (TPM) Infineon 2.0 Memory On-Chip* 26.6 Mb On-Chip SRAM Memory On-SOM 4GB 64-bit DDR4 (non-ECC) and 16 GB eMMC High-Speed PS Connectivity (GTR) PCIe® Gen2 x4, 2x USB3.0, SATA 3.1, DisplayPort™, 4x Tri-mode Gigabit Ethernet General PS Connectivity (MIO) 2xUSB 2.0, 2x SD/SDIO, 2x UART, 2x CAN 2.0B, 2x I2C, 2x SPI, 4x 32b GPIO GTH 12.5 Gb/s Transceivers 4 (PCIe Gen3 x4, SLVS-EC, HDMI 2.0, DisplayPort 1.4) GTR 6 Gb/s Transceivers 4 PS MIO (1.8V) 49 PL High-density (HD) I/O (3.3V) 69 PL High-performance (HP) I/O (1.8V) 116 System Logic Cells (K) 256 DSP Slices 1,248 Typical Power 7.5W Maximum Power** 15W Thermal Interface Passive (Heat spreader) Temp Grade -2 speed grade, low voltage and 0 to 85°C temperature range For more information please visit AMD‘s website for Kria k26 system on module commercial Heatsink is a basic xilinx manufacturer piece retailing for about $30 usd
Price: 280 USD
Location: Henderson, Nevada
End Time: 2024-09-24T22:02:50.000Z
Shipping Cost: N/A USD
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All returns accepted: ReturnsNotAccepted
Brand: Xilinx
